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April 2009

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Subject:
From:
Si-Zhao Qin <[log in to unmask]>
Reply To:
Si-Zhao Qin <[log in to unmask]>
Date:
Sun, 5 Apr 2009 10:53:58 -0700
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Keywords: Meetings, students paper awards

 

 

Advanced Equipment Control/Advanced Process Control (AEC/APC) SYMPOSIUM XXI

September 27-30, 2009

Ann Arbor, Michigan

Student Competition

For the 10th year, the AEC/APC Symposium is conducting a competition for
student papers. Students from all over the world are invited to participate.
The winners will receive an expense-paid trip to the symposium to present
their papers.

 




Call for Papers

The symposium will be built around sessions such as (but not limited to) the
following topics:

Factory-wide and enterprise-wide applications and . deployment 

Sensor development, implementation, and . integration 

Sensor/actuator bus and intelligent sensors . 

Integrated metrology and virtual metrology . 

Advanced process control (APC) integration . with yield management and
design for manufacturability (DFM) 

Real-time data collection and data management . 

Control architecture requirements . 

Merging APC with other capabilities such as real-. time systems, yield,
maintenance management, and adaptive scheduling; merging of data associated
with these applications 

Applications (etch, litho, CVD, PVD, implant) . 

Fault detection and classification (FDC); fault . prediction (FP) 

Future APC needs and requirements . 

Run-to-run, wafer-to-wafer, and real-time control; . process modeling and
model-based control 

Benefits and justification (return on investment, . cost of ownership,
overall equipment effectiveness 

Standards (process control systems, sensorbus, . data quality, integrated
metrology, EDA, time synchronization) 

Tool productivity data collection/analysis . 

e-diagnostics, e-manufacturing, and equipment . engineering capability (EEC)


APC in the next generation factory (NGF) . 

APC and APC-related advancements in solar, LCD . and memory devices
industries 

APC applications to back-end semiconductor . manufacturing

 

 

 Student Competition Guidelines

Applicants must be students who are matriculated in a university or college
degree program. A letter or email of support from the student's faculty
advisor should accompany each entered paper. 

Only full papers will be considered. Papers are to be limited to four pages,
including a one-paragraph abstract. 

Abstracts must be submitted electronically using the template provided
atwww.aecapcsymposium.org

A panel of industry and university representatives will evaluate the papers.
Our target is to accept three to five papers, although the number accepted
will depend upon the quality of the submissions. 

Abstracts, presentations, papers, posters, and any other material must be
non-confidential. Do not submit proprietary information in any materials. 

Provide contact information for the author:

. Full name

. College/University

. E-mail

. Phone number

. Fax number

. Mailing address

The International SEMATECH Manufacturing Initiative (ISMI) is solely
responsible for accepting or rejecting any submissions.

Due dates

May 22, 2009 Submission Deadline

June 19, 2009 Acceptance Notification

August 14, 2009 Final Presentation Due

August 21, 2009 Presentation Reformatting Due

Professors and other industry professionals (non-students) who wish to
submit abstracts should visit www.aecapcsymposium.org for further
information.

 

 

S. Joe Qin, Fluor Professor of Process Engineering
The Mork Family Department of Chemical Engineering and Materials Science
Ming Hsieh Department of Electrical Engineering
Daniel J. Epstein Department of Industrial and Systems Engineering
University of Southern California
925 Bloom Walk, HED 211,
Los Angeles, CA 90089-1211

 



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