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Keywords: Meetings, students paper awards Advanced Equipment Control/Advanced Process Control (AEC/APC) SYMPOSIUM XXI September 27-30, 2009 Ann Arbor, Michigan Student Competition For the 10th year, the AEC/APC Symposium is conducting a competition for student papers. Students from all over the world are invited to participate. The winners will receive an expense-paid trip to the symposium to present their papers. Call for Papers The symposium will be built around sessions such as (but not limited to) the following topics: Factory-wide and enterprise-wide applications and . deployment Sensor development, implementation, and . integration Sensor/actuator bus and intelligent sensors . Integrated metrology and virtual metrology . Advanced process control (APC) integration . with yield management and design for manufacturability (DFM) Real-time data collection and data management . Control architecture requirements . Merging APC with other capabilities such as real-. time systems, yield, maintenance management, and adaptive scheduling; merging of data associated with these applications Applications (etch, litho, CVD, PVD, implant) . Fault detection and classification (FDC); fault . prediction (FP) Future APC needs and requirements . Run-to-run, wafer-to-wafer, and real-time control; . process modeling and model-based control Benefits and justification (return on investment, . cost of ownership, overall equipment effectiveness Standards (process control systems, sensorbus, . data quality, integrated metrology, EDA, time synchronization) Tool productivity data collection/analysis . e-diagnostics, e-manufacturing, and equipment . engineering capability (EEC) APC in the next generation factory (NGF) . APC and APC-related advancements in solar, LCD . and memory devices industries APC applications to back-end semiconductor . manufacturing Student Competition Guidelines Applicants must be students who are matriculated in a university or college degree program. A letter or email of support from the student's faculty advisor should accompany each entered paper. Only full papers will be considered. Papers are to be limited to four pages, including a one-paragraph abstract. Abstracts must be submitted electronically using the template provided atwww.aecapcsymposium.org A panel of industry and university representatives will evaluate the papers. Our target is to accept three to five papers, although the number accepted will depend upon the quality of the submissions. Abstracts, presentations, papers, posters, and any other material must be non-confidential. Do not submit proprietary information in any materials. Provide contact information for the author: . Full name . College/University . E-mail . Phone number . Fax number . Mailing address The International SEMATECH Manufacturing Initiative (ISMI) is solely responsible for accepting or rejecting any submissions. Due dates May 22, 2009 Submission Deadline June 19, 2009 Acceptance Notification August 14, 2009 Final Presentation Due August 21, 2009 Presentation Reformatting Due Professors and other industry professionals (non-students) who wish to submit abstracts should visit www.aecapcsymposium.org for further information. S. Joe Qin, Fluor Professor of Process Engineering The Mork Family Department of Chemical Engineering and Materials Science Ming Hsieh Department of Electrical Engineering Daniel J. Epstein Department of Industrial and Systems Engineering University of Southern California 925 Bloom Walk, HED 211, Los Angeles, CA 90089-1211